UV/Green Light Laser PCB Separator
This equipment is mainly used for precision cutting of materials such as FPC, PCB, aluminum foil, and copper foil. Equipped with UV/green light lasers, it achieves cutting without taper, no residue on edges, smooth cross-sections, and almost no cracks on cutting edges. Through fine laser focusing technology, an extremely small light spot (focus spot diameter less than 20μm) is obtained, enabling ultra-precision processing.
Product Details
Features
- Optimizes speed and effect under the same power; meanwhile, performs efficient dust-proof treatment to effectively extend the equipment’s shutdown period for cleaning and maintenance;
- Enables in-line cutting and unmanned operation, saving labor costs;
- No consumables or tool wear during processing;
- No taper or residue on edges, smooth cross-sections, almost no cracks on cutting edges; ultra-precision processing is achieved through fine laser focusing technology with a small light spot (focus spot diameter less than 20μm);
- Equipped with auxiliary machine vision and automatic calibration, featuring high-precision image recognition and positioning functions for convenient and fast operation;
- Laser action point has concentrated energy and high peak power, ensuring high cutting efficiency and capable of cutting various PCB boards with complex shapes.
Specifications
| Parameter | Specification |
| Processing Range | 350mm*350mm |
| Scanning Range of Galvanometer | 40mm×40mm |
| Scanning Speed | ≤5000mm/s |
| X, Y Positioning Accuracy | ±3um |
| X, Y Repeat Positioning Accuracy | ±2um |
| Platform Moving Speed | ≤1000mm/s |
| CCD Positioning Accuracy | ±3um @5 – million pixels |
| Minimum Cutting Line Width | <20um |
| Maximum Cutting Thickness | 1.0mm |
| Comprehensive Cutting Accuracy | ±30um |
| Equipment Overall Dimensions | 1000mm*1200mm*1520mm (excluding three – color light) |
| Equipment Weight | 1200kg |
