SMT Electronics industry

laser cut circuit board without carbonization

Advantage of Laser Manufacturing

1. Consumable saving

Laser processing can reduce PCB board spacing, reduce PCB waste and save tools and other consumables

2. High-quality

No carbonization, no cutting stress.
No burrs/less dust, high cutting accuracy (20um)

3. High efficiency

In the thickness of the motherboard less than 1mm, the laser cutting efficiency is close to the milling cutter

4. Flexibility

CCD-Mark positioning, It can be quickly changed to achieve flexible production of multiple varieties

PCB section cutting section
PCB section cutting section

SMT Industry Dedicated Laser Equipment Display

For PCB industry PBCA/PBC cutting, FPC split-board cutting, or other rigid and flexible materials precision machining

Dual platform laser splitter
Dual platform laser splitter
Machining accuracy: ±20μm
Machining material thickness: <2mm
Maximum processing size: 300X350mm
X/Y axis repeated positioning accuracy: 2um
X/Y axis positioning accuracy: <±3um
Laser: UV nanosecond 15W

Equipment Advantage

  1. Automatic feeding and setting
  2. Double head laser cutting detection, can automatically expand and shrink compensation
  3. Linear motor, high precision, fast speed
  4. One time to achieve cutting and automatic splicing function, With multi-point recognition function
  5. Multi-power cutting head to meet the cutting needs of different products
  6. Multi-power cutting head to meet the cutting needs of different products

Used in the circuit board industry PBCA/PBC cover film (CVL) window cutting, FPC board cutting, LTCC cutting, etc

Uv nano laser splitter
UV nano laser splitter
Machining accuracy: ±20μm
Machining material thickness: <2mm
Maximum processing size: 300X350mm
X/Y axis repeated positioning accuracy: 2um
X/Y axis positioning accuracy: <±3um
Laser: UV nanosecond 15W

Equipment Advantage

  1. Automatic feeding and setting
  2. Double head laser cutting detection, can automatically expand and shrink compensationa
  3. Linear motor, high precision, fast speed
  4. One time to achieve cutting and automatic splicing function, With multi- point recognition function
  5. Multi-power cutting head to meet the cutting needs of different products
  6. Support OPC/ network port and serial port communication, customized MES interface

Applied to PCB/FPC surface/glass/stainless steel sheet marking, text pattern engraving; Shield cover surface marking, resin IC surface marking, etc

Laser marking equipment
Laser marking equipment
Marking accuracy: ±1um
Processing format (monorail) : 450mm*330mm
Processing format (double track):200mm*200mm
Platform positioning accuracy: ±3um
Processing method: online
Laser output power :5W

Equipment Advantage

  1. The software interface feeds back the processing status in real time
  2. High precision and non-contact machining
  3. With three-axis to seven-axis multi-axis linkage system precision control
  4. Equipped with advanced intelligent control system
  5. Suitable for soft plastic, hard metal and other materials

Why Choose Cas Micromach

High Precision Cutting

Cutting accuracy up to micron level, suitable for high density Fine processing of multi-layer PCB board

The Heat Affected Area Is Small

UV laser has very low thermal effect, reducing thermal damage to the surrounding circuit and solder joints

Cut Section Without Burrs

After the laser beam is focused, the slit is smooth and burrless, reducing the secondary processing of the subsequent assembly process

Suitable For A Variety Of Materials

Support FR4, FPC, soft and hard bonding board and ultra-thin metal and other materials cutting

Flexible Manufacturing

Programmable path ADAPTS to complex graphics cutting to meet diverse design needs

Easy Automated Integration

Support OPC/ network port and serial communication, customized MES interface, easy to automate integration

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