Ultra-Precision Micro-Hole Machining Solution

We provide advanced processing systems based on ultrafast lasers (femtosecond-class) for the following applications: large-format, high-volume microstructure machining in the high-precision mold industry; ultra-fine machining of critical components in the semiconductor industry, such as ceramic packaging substrates, precision lithography system components, and ion source grids; high-precision micro-hole machining of core components in automotive engine systems; and machining of critical components in the medical field, such as liquid metal bearings. Through high energy density and ultrashort pulse characteristics, these systems enable efficient cold processing of complex structures at the micrometer scale, eliminating heat-affected zones and ensuring zero melting and burr-free results. Equipped with high-precision motion platforms and process parameter optimization systems, we provide customers with end-to-end services ranging from process development to mass production, empowering the high-end manufacturing industry to upgrade toward greater precision and intelligence.