Compared with traditional industrial cutting methods, laser cutting effectively demonstrates the processing advantages of photonic manufacturing, such as high precision and flexibility. It is widely applicable for precision cutting in the electronic field, such as consumer electronics, automotive electronics, communication electronics, etc.
Case Studies
Connector material bridge cutting
Single-sided material bridge cutting time (0.12s tin/chromium plated on 0.2mm thick copper)
High efficiency meets the requirements of conventional production line CT, with no carbonization and no burrs
The OS yield is high, >99%
There was no defect in the SI test
Low-temperature welding of vehicle-mounted cameras
The seam width: 0.7mm
Penetration depth: 0.4mm
Efficiency: 10mm/s
The welding temperature: below 60℃
The appearance is smooth and free of oxidized black
No splashing
DPC circuit board cutting
The cutting efficiency is 20mm/s for plates with a thickness of 0.5mm
The cutting efficiency for plates with a thickness of 1mm is 5mm/s
Dimensional accuracy: ±20μm
The marking semi-cutting efficiency is 200mm/s
PCB QR code marking
The size accuracy of the laser engraving on the QR code is grade A
The light spot is uniform and smooth
The background pattern is clear
The dimensional accuracy of laser engraving is ±0.05mm
PCB no carbonization cutting
The cutting speed for a 2mm thick PCB board is 25mm/s
Accuracy: ±20μm
The heat impact is less than 20μm
No carbonization at the edge
The backplane of MinLED is cut without carbonization
The cutting speed for 1.6mm plate thickness is 25mm/s
