Laser Etching Solution

Addressing the high-precision machining needs of complex curved surfaces and non-metallic microstructures in aerospace applications, we focus on high-quality, high-efficiency laser machining technologies for complex curved surface microstructures, providing customers with high-end precision machining services and complete product solutions, including nanosecond lasers, picosecond lasers, and femtosecond lasers.

Case Studies

Laser texturing of metallic surfaces

Laser processing of high-temperature alloy surfaces can achieve a maximum surface roughness of Ra15.

Thin-walled parts exhibit no deformation, no oxidation, and no remelted layer.

Laser texturing of composite material surfaces

Laser processing of woven composite surfaces

Exposed fiberglass layer

No damage to the glass substrate

Substrate without blackening and carbonization

Resonant microstructure etching

Multi-layer metal plating + composite substrate, etching damage to the substrate.: ≤30μm

Machining accuracy: ±0.01mm

Minimum machining size: 0.1mm

The coating did not peel off after etching, and the substrate did not turn black or carbonize.

Resonant microstructure etching

70μm copper plating layer + glass fiber composite, etching of copper plating layer leaves no residue, no damage to substrate: ≤30μm

Machining accuracy: ≤±0.01mm

Minimum machining size: 0.1mm

The substrate is free from blackening and carbonization.

Resonant microstructure etching

3μm aluminum coating + glass fiber composite, etching of aluminum coating, substrate damage: ≤5μm

Machining accuracy: ≤±0.01mm

Minimum machining size: 0.1mm

No aluminum particles remain, and the glass fiber is free of carbonization.

Resonant microstructure etching

Machining accuracy: ≤±0.01mm

Minimum machining size: 0.1mm

Metal coating + composite material substrate, surface etching of metal coating, composite material without damage, blackening, or carbonization.

Friction ring etching

Etching depth: 5±1μm

Machining accuracy: ±0.01mm

Depth accuracy: ±0.005mm

The parts are free of scratches, oxidation, burrs, and remelted layers.

Cutting of hemispherical metal shield

Metal thickness: 0.3mm,

0.1mm Part dimensions: φ300mm

high: 180mm

Single array size: 1.18mm

Machining accuracy: ±0.01mm

Minimum machining size: 0.1mm

No burrs or carbonization after cutting

Special coating microstructure scribing

Five-axis linkage X, Y, Z, Gx, Gy laser processing linewidth: ≤0.02mm

Processing depth: ≤0.01mm

Line spacing: 0.2±0.005mm

The processed lines are symmetrical, without obvious bending, deformation, or blackening.

Industry Applications

Aerospace

Automotive

Electronic

Electronics

Medical

Medical

Semiconductor

Semiconductor

Industrial Machinery

Industrial Machinery

Robotics Automation

Robotics Automation

Die Mold

Die Mold

Energy

Energy

Education

Education

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