Coverlay Non-Carbonization Laser Cutting Equipment

Product Details

Features

  • The equipment adopts a marble anti-vibration platform with a stable and solid overall structure and an integrated enclosed structure, providing guarantees for high-speed, high-precision, and high-yield production;
  • Equipped with a picosecond ultraviolet ultrafast laser, the ultrashort pulse processing has almost no heat conduction, with good beam quality and stable power;
  • Integrates imported high-precision digital scanning galvanometer and high-precision linear motor platform;
  • The professional cutting software can directly import DXF graphics made by CAD and cut accurately according to the input graphics, realizing what you see is what you get.

Applicable Industries

It can be applied to the precision cutting of various non-metallic materials such as flexible OLED screens, 5G application materials, LCP, FPC, coverlay, camera modules, silicon wafers, and MPI, as well as the etching and surface treatment of various metal materials.

Specifications

ParameterSpecification
Laser Power15W
Maximum Cutting Size of Product550*500mm
Laser Pulse Width<15ps
Scanning Range of Galvanometer50mm×50mm
Scanning Speed of Galvanometer≤8000mm/s
Positioning Accuracy of Platform±3um
Repeat Positioning Accuracy of Platform±1.5um
Moving Speed of Platform≤1000mm/s
CCD Positioning Accuracy±5um @2 million pixels
Minimum Cutting Line Width≤25um
Cutting Dimension Accuracy±30um
Equipment Dimensions1500mm*1300mm*1750mm
Equipment WeightApproximately 1600kg

Leave Your Message

    Support file types: images, compressed files rar or zip; Size 20mb


    Scroll to Top