
Fiber Laser Ceramic Laser Processing Equipment
Product Details
Features
- Stress-free non-mechanical contact processing; supports DXF document import and can process arbitrary graphics;
- Small light spot, thin line width, high peak energy, achieving high processing efficiency with minimal heat-affected zone;
- Equipped with auxiliary machine vision and automatic calibration, featuring high-precision image recognition and positioning functions for convenient and fast operation;
- Electro-optical conversion efficiency > 30%; air-cooled compact product; fiber laser with high stability and maintenance-free operation;
- Can be flexibly matched with loading and unloading mechanisms to realize automated operations.
Applicable Industries
- Drilling and cutting of LED ceramic substrate brackets;
- Dicing of automotive & LED ceramic circuit substrates;
- Smart terminal electronic products such as mobile phone backplanes and 3C electronics;
- Precision contour cutting of watch gears & eyeglass frames;
- Drilling of earpiece and sound cylinder.
Specifications
| Parameter | Specification |
| Platform Movement Range | 350mm*350mm (optional) |
| Maximum Cutting Size | 300mm*250mm (optional) |
| Cutting Speed | ≤50mm/s |
| Scribing Speed | ≥200mm/s |
| Positioning Accuracy | ±3um |
| Repeat Positioning Accuracy | ±2um |
| Minimum Cutting Line Width | ≤20um |
| Cutting Thickness | ≤2mm |
| Smallest Processed Hole | Φ0.05mm |
| Processing Accuracy | ≤±5um |
| Equipment Dimensions | 1400mm*1200mm*1700mm |
| Equipment Weight | Approximately 1500kg |







