Fiber Laser Ceramic Laser Processing Equipment

Product Details

Features

  • Stress-free non-mechanical contact processing; supports DXF document import and can process arbitrary graphics;
  • Small light spot, thin line width, high peak energy, achieving high processing efficiency with minimal heat-affected zone;
  • Equipped with auxiliary machine vision and automatic calibration, featuring high-precision image recognition and positioning functions for convenient and fast operation;
  • Electro-optical conversion efficiency > 30%; air-cooled compact product; fiber laser with high stability and maintenance-free operation;
  • Can be flexibly matched with loading and unloading mechanisms to realize automated operations.

Applicable Industries

  1. Drilling and cutting of LED ceramic substrate brackets;
  2. Dicing of automotive & LED ceramic circuit substrates;
  3. Smart terminal electronic products such as mobile phone backplanes and 3C electronics;
  4. Precision contour cutting of watch gears & eyeglass frames;
  5. Drilling of earpiece and sound cylinder.

Specifications

ParameterSpecification
Platform Movement Range350mm*350mm (optional)
Maximum Cutting Size300mm*250mm (optional)
Cutting Speed≤50mm/s
Scribing Speed≥200mm/s
Positioning Accuracy±3um
Repeat Positioning Accuracy±2um
Minimum Cutting Line Width≤20um
Cutting Thickness≤2mm
Smallest Processed HoleΦ0.05mm
Processing Accuracy≤±5um
Equipment Dimensions1400mm*1200mm*1700mm
Equipment WeightApproximately 1500kg

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