Automatic Precision Laser Cutting Equipment MU300A
This equipment is primarily used for fully automatic depaneling and cutting of chip modules, camera modules, TYPE-C modules, and other components in electronic industry production. It integrates functions such as fully automatic box feeding, feeding inspection, dual-platform precision laser processing, automatic product inspection, and fully automatic tray loading. This integration saves labor costs and significantly enhances production efficiency.
Product Details
Features
- The equipment can realize fully automatic box feeding, feeding inspection, dual-head laser cutting, cutting inspection, and tray loading into trays;
- Processed edges are burr-free, free from thermal influence, and non-collapsing;
- It can promptly detect equipment abnormalities and take braking measures to reduce the output of defective products;
- Equipped with automatic positioning and software-based automatic correction;
- No manual intervention is required throughout the entire processing process, greatly improving production efficiency.
Specifications
| Indicator | Performance Parameters |
| Product Loading/Unloading Method | Cassette loading/Tray unloading |
| Product Specification | 150mm*50mm – 300mm*100mm |
| MARK Positioning Accuracy | ±5μm |
| Cutting Accuracy (Zhongke Conditions) | ±0.03mm |
| Laser Output Power | 15W/25W/35W/60W |
| Output Wavelength | 355nm/532nm |
| Accepted File Type | DXF |
| Main Unit Dimensions | 3500mm*1700mm*1900mm |
| Main Unit Weight | 4500kg |
| Power Supply | AC220V/15KW |
| Ambient Temperature | Room temperature: 18℃ – 25℃ |
| Ambient Humidity | 30% – 75%, no condensation |
