MC-F350-AT
The fiber laser ceramic processing equipment is specifically designed for cutting hard and brittle ceramic materials. It excels in processing alumina, aluminum nitride, silicon nitride, zirconia ceramics, and sapphire. Its key technological advantages include: Clean and residue-free scribing edges; High-speed drilling of micro-holes with diameters below 0.15mm; Minimal heat-affected zone (HAZ) with no thermal cracking.
Product Details
Features
- Small spot size: enables high-quality, high-efficiency precision processing
- Minimal heat impact: reduces material selection constraints and prevents thermal damage
- Fully automated operation: features automatic loading and unloading, assisted by machine vision for automatic calibration and alignment
- DXF file import: supports DXF graphic import for layered processing of various basic shapes
Specifications
| Platform Movement Range (mm) | 350 × 350 |
| Maximum Processing Size (mm) | 300 × 250 |
| Drilling Efficiency (/) | ≥8 holes per second (Φ0.1mm @ T0.5mm @ S2mm) |
| Scribing Speed (mm/s) | 10 – 200 |
| Minimum Hole Diameter (mm) | Φ0.04 |
| Platform Positioning Accuracy (μm) | ±3 |
| Repeat Positioning Accuracy (μm) | ±2 |
| Hole Roundness (μm) | ≤±20 (Φ0.1mm@T0.5mm) |
| Minimum Cutting Line Width (μm) | 30 |
| Cutting Thickness (mm) | ≤2 |
| Dimensions (W × D × H) | 1440 × 1400 × 2000 |
| Weight (kg) | 1650 |
