MicroEtch 200L
The equipment utilizes a high-power ultrafast laser as the processing light source. Built upon a three-axis fixed-gantry mainframe, it is equipped with a core optical dual-swing-axis module, making it ideal for precision etching of functional microstructures on large, complex 3D curved surfaces.With five-axis simultaneous linkage, surface model segmentation and stitching, and parallel light projection, the system enables advanced 3D model processing and high-precision etching on three-dimensional curved surfaces, ensuring superior accuracy and efficiency.
Product Details
Features
- Supports large-format etching on complex, non-developable 3D curved surfaces, ensuring high precision and efficiency.
- Integrated 3D model analysis and programming capabilities, enabling precise segmentation and path optimization.
- Real-time 3D model processing visualization, allowing users to monitor the machining process.
- Advanced vision-based alignment and high-precision automatic distance focusing, ensuring accurate processing.
- Built-in anti-collision function, enhancing operation safety.
- Hardware status monitoring system for detecting anomalies, featuring an intuitive HMI for simple and user-friendly operation.
- One-click processing data generation, eliminating the need for manual programming.
- Integrated safety interlock system, ensuring laser operation safety.
Specifications
| X/Y/Z Free Travel Range (mm) | 2000/1600/800 |
| X/Y/Z Positioning Accuracy (mm) | 0.02 |
| X/Y/Z Repeatability Accuracy (mm) | 0.01 |
| A/C Axis Travel (°) | ±110/0-360 |
| A/C Axis Positioning Accuracy (″) | 15 |
| A/C Axis Repeatability Accuracy (″) | 10 |
| Pulse Width (ps) | 1-5 |
| Average Power (w) | 50 |
| Max Workpiece Size (Cylindrical) (mm) | φ900 × 800 |
| Single Scan Marking Accuracy (mm) | ±0.02 |
| Weight (t) | ~25 |
| Dimensions (mm) (W × D ×H) | 4100 × 6200 × 4500 |
| Worktable Size (mm) (L × W) | 2000 × 1400 |
| Worktable Load Capacity (kg) | 3000 |
★ Machine travel and laser configuration can be customized
